XS22V2-V
XS22V2-V is powered by 2× 3rd Gen Intel Xeon Series Scalable processor server systems. It not only provides high-bandwidth network communication capabilities, but also provides superior scalability and flexibility, while significantly reducing its TCO.
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- 商品名稱: XS22V2-V
- 産品定位: Whitley 2S2U General Server
- 産品序号: 服務器
- 平台: Intel
- 類型: 通用
- 規格: 2U
- 列表數據: 服務器
XS22V2-V is powered by 2× 3rd Gen Intel Xeon Series Scalable processor server systems. It not only provides high-bandwidth network communication capabilities, but also provides superior scalability and flexibility, while significantly reducing its TCO.
Product Code XS22V2-V Processor 1 or 2×Intel® 3th Gen Xeon® Scalable Processors Ice Lake,max 270W Chipset Intel C621A Memory 32× DDR4 slots,16 channels,up to 3200MT/s (2DPC)
Support RDIMM、LRDIMM、3DS DIMM、BPS DIMM
Storage Support 7x Slimline (x8) PCIe 4.0 + 3x miniSAS(x4) SATA3
Front: 12x 3.5” or 24x 2.5”SAS/SATA/NVMe HDD, hot-swappable
Up to 16× 3.5” SATA HDDs
Rear: 2x 2.5”SATA HDD, hot-swappable
Internal: 2x M.2 SSDs(SATA/PCIe×1)
PCIe Expansion Up to 6x PCIe4.0×16 slots + 1x OCP3.0 slot
Up to 2x FHFLDW GPU or 8x SFHFLW GPU
Network 1×1GbE IPMI RJ45
1× OCP3.0, 4×1GbE / 2×10Gb SFP+ / 4×10Gb SFP+/ 2×25Gb SFP28 option
I/O Ports Front:2× USB3.0, 1× VGA, 1× Power button,1× UID,1× Reset
Rear:1× 1GbE IPMI RJ45,2× USB3.0, 1× VGA
Management AST2500, 1 RJ45 Gigabit management network port Security TPM2.0 option Power 2×Power Modules, support 1+1 redundancy
800W/1300W option
Fan 6×6056 hot-swappable fan modules for N+1 redundancy Dimension 2U standard rack server
W 438mm × H 88mm × D 780mm
Environment Operating temperature:5ºC - 35ºC -
Features
Excellent Performance
Support 2× 3rd Gen Intel scalable processors, TDP up to 270W;
Support 32× DDR4 DIMM, 8-channel,Up to 3200MHz, 6TB; Supports PCIe 4.0 protocol.
Flexible Configuration
Support 6x PCIe4.0 x16 slots + 1x OCP 3.0 slots;
Support 7xSlimline x8 PCIe4.0 + 3x miniSAS (x4) SATA3 for storage;
Up to 12x LFF or 24× SFF HDD, hot-swappable;
2×onboard M.2 SATA/PCIe×1 SSD for OS drive.
Stable & Reliable
The modular design improves maintainability and supports a wide range of maintainable parts for toolless operation;
Support N+1 redundancy for power supplies and dissipated heat fans;
Integrated intelligent management chip, support IPMI 2.0, Redfish, SNMP, remote KVM, virtual media, etc.
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